8" - 3M™ 3762LMQ Low-Melt Glue SticksLow melt is applied at 265 F. to bond heat sensitive substrates such as polystyrene foam. Excellent "hot tack" when dispensed at low melt temperatures. Can bond expanded polystyrene, corrugated packaging and displays. 25 second bonding range. FDA listed.
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product description
Why choose thelockerguy wholesale?
Low-melt is applied at 265° F. to bond heat sensitive substrates such as polystyrene foam. Excellent "hot-tack" when dispensed at low-melt temperatures.
Can bond expanded polystyrene, corrugated packaging and displays.
25 second bonding range.
FDA listed.